Lankun Microelectronics Raises Hundreds of Millions RMB for Optical Interconnect

Optical interconnect startup Lankun Microelectronics closed two consecutive rounds totaling several hundred million RMB. Round one was led by Longqiu Capital (LPs include Ruijie Networks and Wus Printed Circuit) and GGV Capital; round two was led by Guanghe Ventures and Longqiu, with SMIC Juyuan participating; seed backers including Jinqiu, Loongson Ventures, Tengye, Zhangjiang Haoheng, and Shuimu Tsinghua re-upped. Proceeds go to 3D optoelectronic packaging, wafer capacity for volume production, and building out a full optical I/O R&D team in the compute-interconnect stack. Related: supernodes and optical interconnect; more rounds on AI Investment.